Electronics & Semiconductors
Ingress protection, EMI shielding, outgassing control — the right material in the right place, specified right the first time.
Electronic enclosures, control cabinets, and semiconductor process equipment place very different demands on sealing materials — and often on the same assembly. Enclosure seals must hold an IP rating over years of thermal cycling without compression set. EMI gaskets must maintain contact resistance below 10 mΩ/cm² after thousands of open/close cycles. Plasma chamber seals must resist fluorine and oxygen plasma chemistry at elevated temperatures while generating zero contaminating particles or outgassing products that would compromise the wafer process. Getting the material wrong costs more than the seal — it costs yield, qualification time, and in regulated environments, a field recall.
Our Products
ELASFOR Product Line — Electronics & Semiconductor Applications
| ELASFOR Product | Electronics / Semiconductor Application |
|---|---|
70×70
O-rings — FFKM, Silicone, FKM
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Plasma etch chamber ports, vacuum flange connections, and gas delivery manifolds — FFKM for fluorine/chlorine/O₂ plasma environments; ultra-pure silicone for low-outgassing cleanroom applications; FKM for general-purpose enclosure and utility connections |
70×70
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EMI/RFI shielding gasket extrusions (conductive silicone), closed-cell EPDM and silicone sponge profiles for IP-rated enclosure perimeters, door seals for control cabinets and junction boxes, custom cross-sections to groove dimensions |
70×70
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Die-cut cover gaskets for enclosures, junction boxes, and instrument panels; EMI shielding gaskets cut from conductive elastomer sheet; EPDM sheet for general-purpose weatherproofing; closed-cell sponge sheet gaskets for gasketed covers and cable entry plates |
70×70
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Molded EPDM and silicone cover seals for proprietary enclosure designs, grommet seals for cable penetrations, molded corner pieces for complex enclosure geometries, diaphragms for pressure-sensing transducers in industrial electronics |
| Vacuum chamber flange seals, process gas connection seals, and UHV-compatible static seals for semiconductor equipment — FFKM grades meeting ASTM E595 outgassing requirements (TML ≤ 1.0%, CVCM ≤ 0.10%) | |
70×70
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Gas distribution valve stem seals and diaphragm seals for ultra-high-purity process gas systems; PTFE-encapsulated O-rings for corrosive chemical delivery lines in wet bench and etch equipment; spring-energized PTFE lip seals for pump shafts in chemical mechanical planarization (CMP) equipment |
Material traceability and outgassing data are often required before seal qualification in semiconductor equipment. We can provide ASTM E595 outgassing test reports, compound data sheets, and RoHS/REACH compliance statements for relevant product grades — ask at time of inquiry.
Applications
Common Sealing Applications
EMI / RFI Shielding Gaskets & Extrusions
Electronics enclosures, RF shielded rooms, test equipment cabinets, military/aerospace housings, and industrial control panels where radiated emissions must be contained or external interference excluded. Shielding effectiveness is a function of contact resistance — which depends on continuous metal-to-metal contact through the gasket, consistent compression force, and corrosion resistance of the conductive filler system.
Silver/aluminum (Ag/Al) filled silicone provides the best shielding attenuation (100 dB+ at 1 GHz) and is the standard for demanding military and telecom applications. Nickel/carbon (Ni/C) filled silicone is the cost-effective choice for commercial enclosures (60–80 dB attenuation range) with good corrosion resistance. Conductive EPDM is used where weather resistance is also required (outdoor cabinet door perimeters). All conductive extrusions can be produced in custom cross-sections — D-profiles, P-profiles, flat strips — to fit existing groove dimensions.
MIL-DTL-83528 · MIL-STD-461 · IEC 61000-5-7 · IEEE 299 · RoHS Directive 2011/65/EU
Thermal Interface Pads & Gap Fillers
Power semiconductors (IGBTs, MOSFETs, power modules), CPU/GPU heat sink assemblies, LED driver boards, inverter stacks, and battery management systems where mechanical contact between components and heat sinks is imperfect and direct solder bonding is not feasible. Thermal pads fill surface irregularities, conform under bolt load, and maintain thermal contact over thermal cycling without adhesive.
Silicone-based thermal pads (1.0–6.0 W/m·K) are the workhorses — conformable, electrically isolating, compatible with most surfaces, available in thicknesses from 0.25 mm to 6 mm. Graphite-filled pads (10–15 W/m·K) for high-flux applications where isolation is not required. Phase-change materials melt and re-solidify at operating temperature, eliminating pump-out under thermal cycling. Always specify dielectric strength (V/mm) alongside thermal conductivity — the two properties trade off depending on filler type and loading level.
ASTM D5470 (thermal impedance measurement) · IEC 62631-3 (dielectric properties) · RoHS Directive 2011/65/EU · UL 94 V-0 (flammability)
Closed-Cell Sponge & Foam Gaskets
Outdoor junction boxes, power distribution cabinets, roadside control enclosures, electrical panels, and instrumentation housings exposed to rain, dust, UV, and wide temperature ranges. Closed-cell sponge gaskets seal at much lower bolt loads than solid elastomer, tolerate surface irregularities, and recover elastically after compression cycling — making them the standard choice for gasketed enclosure lids and inspection covers.
EPDM closed-cell sponge is the standard for outdoor electrical enclosures — outstanding ozone, UV, and weathering resistance, low compression set, compatible with most aqueous environments. Silicone sponge for high-temperature or extreme cold applications where EPDM stiffens beyond its usable range. Neoprene sponge where occasional oil splash or hydraulic fluid contact is possible alongside weather exposure. Specify compression deflection value (ASTM D1056 Grade designation) against your actual bolt closure force to confirm you will achieve the target contact stress for the IP rating.
ASTM D1056 (sponge rubber) · IEC 60529 (IP ratings — enclosure protection) · UL 50E · UL 94 V-0 (flame rating where required)
Enclosure Cover Gaskets & Molded Seals
Industrial electrical enclosures (IEC 61439), automation control panels, power conversion equipment, railway trackside junction boxes, and outdoor instrumentation housings. Cover gaskets must maintain their compression set resistance across hundreds or thousands of door open/close cycles, wide temperature swings, and UV exposure, while sealing against variable flange surface finishes — from machined aluminium to powder-coated steel.
For enclosures cycling ≥ 50 times/year, a compression-moulded gasket ring with factory-vulcanised corners (no adhesive joints) is the correct specification. Extruded profiles with butt joints are acceptable for low-cycle lids and inspection covers. Silicone is the right choice for enclosures near heat sources (>120°C surface temperature) or in extreme cold (Canadian outdoor winters, −40°C) where EPDM compression set degrades performance. EPDM remains the cost-effective standard for normal IP65/IP66 industrial enclosure service from −40°C to +100°C.
IEC 60529 · IEC 61439 · NEMA 250 · UL 50 · EN 62208 · RoHS Directive 2011/65/EU
Plasma-Resistant Seals — Semiconductor Fabs
Plasma etch reactors, CVD (chemical vapour deposition) chambers, PVD sputtering systems, ion implant equipment, and high-vacuum process chambers using fluorine-based (CF₄, SF₆, NF₃, HF), chlorine-based (Cl₂, BCl₃), or oxygen plasma chemistries. Seals in these environments require exceptional resistance to plasma oxidation and chemical attack, low outgassing to avoid contaminating the process environment, and consistent dimensional stability at elevated chamber wall temperatures (60–120°C).
FFKM (perfluoroelastomer) is the only elastomeric material with sufficient plasma resistance and outgassing performance for direct chamber use — grades such as Kalrez 6375 and Chemraz 625 are specifically developed for plasma etch service. ASTM E595 outgassing: TML (total mass loss) ≤ 1.0% and CVCM (collected volatile condensable material) ≤ 0.10% are the standard qualification thresholds for semiconductor equipment. PTFE-encapsulated O-rings for corrosive gas delivery lines where plasma exposure is absent but chemical attack from HF, Cl₂, or NF₃ at elevated temperatures is the primary concern. Do not specify standard FKM or silicone in direct plasma-exposure zones — erosion rate in fluorine plasma is 10–50× higher than FFKM.
ASTM E595 (outgassing — TML/CVCM) · SEMI F57 (ultrapure water compatible materials) · SEMI C10 (fluorine-based process chemicals) · RoHS Directive 2011/65/EU
Compliance
Governing Standards
| Standard | Scope | What It Covers for Seals |
|---|---|---|
| MIL-DTL-83528 | Conductive elastomer gaskets — EMI shielding | Shielding effectiveness, contact resistance, compression set, and corrosion resistance requirements for conductive elastomer gaskets used in military and aerospace electronics enclosures |
| MIL-STD-461 | EMI/EMC requirements for equipment | Radiated and conducted emission/susceptibility limits; EMI gaskets must be specified to achieve enclosure attenuation levels required by applicable test limits |
| IEC 60529 | Ingress protection (IP) ratings for enclosures | Classification and test methods for protection against solid particles (first digit, 0–6) and liquids (second digit, 0–9K); gasket material and compression force selection drives achievable IP rating |
| ASTM D1056 | Sponge and expanded rubber materials | Classification of closed-cell and open-cell sponge rubber by compression deflection, density, compression set, fluid resistance, and temperature range; grade designation maps directly to enclosure gasket performance |
| ASTM E595 | Outgassing of materials in vacuum | Total mass loss (TML) and collected volatile condensable material (CVCM) — the two qualification thresholds used to approve seal materials for semiconductor process chambers and spacecraft applications; standard pass criteria: TML ≤ 1.0%, CVCM ≤ 0.10% |
| SEMI F57 | Polymeric components for ultrapure water systems | Extractable metallic and organic contamination limits for elastomers and polymers in contact with ultrapure water (UPW) in semiconductor fabs; governs O-ring and gasket material selection for UPW distribution piping |
| SEMI C10 | Fluorine-based process chemical handling | Material compatibility requirements for equipment exposed to HF, NF₃, F₂, and related fluorine chemistry; direct reference for O-ring and seal material selection in etch gas delivery systems |
| IEC 61439 | Low-voltage switchgear and controlgear assemblies | Construction, performance, and verification requirements for power distribution enclosures; cover gaskets must maintain IP rating specified in the assembly's type test documentation |
| UL 94 | Flammability of plastic materials | V-0 (self-extinguishing in ≤ 10 s) is typically required for gasket and seal materials inside electrical enclosures and control panels — specify UL 94 V-0 rated compound when the enclosure standard requires it |
| RoHS Directive 2011/65/EU | Restriction of hazardous substances in EEE | Restricts lead, mercury, cadmium, hexavalent chromium, PBB, PBDE, and (since 2019 amendment) four phthalates in electrical and electronic equipment components — all sealing materials supplied for electronics applications should carry RoHS compliance statements |
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